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High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Bonding Wire

High Bond Strength Gold Plated Silver Wire

Smooth Surface Finish Spooled Wire

Место происхождения:

КИТАЙ

Фирменное наименование:

WINNER

Сертификация:

ISO9100

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Спросите цитату
Детали продукта
Покрытие:
Золото
Сила связи:
Высокий
сертификаты:
ISO 9001
Коррозионная стойкость:
Высокий
Удлинение:
3-20%
Тип продукта:
Связывающий проволоки
Поверхностная отделка:
Гладкий, матовый, текстурированный
Диаметр:
0,7-1,0 мил
Материал:
Золото, серебро
Чистота:
99,99%
Выделить:

High Conductivity Bonding Wire

,

High Bond Strength Gold Plated Silver Wire

,

Smooth Surface Finish Spooled Wire

Условия оплаты & доставки
Количество мин заказа
1000м
Цена
999
Упаковывая детали
Бросок, нейтриальная упаковка или с логотипом OEM
Время доставки
5-8 дней
Условия оплаты
T/T, D/A, Western Union
Поставка способности
9999999
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Характер продукции
High Conductivity Gold Plated Silver Wire on Spool
Factory Supply Ultra Fine Gold Plated Silver Wire
Gold Plated Silver Spooled Wire combines the high conductivity of silver with the corrosion resistance of gold, making it ideal for scientific research and laboratory use. This specialized wire is engineered for demanding applications where signal integrity must be maintained under extreme conditions.
Key Applications
  • Cryogenic systems and superconducting circuits
  • High-frequency RF and microwave assemblies
  • Quantum computing research
  • Particle detection systems
  • Photonics instrumentation
  • Materials science research
  • Aerospace testing applications
  • Precision engineering projects
  • Advanced sensor development
Product Advantages
  • Superior conductivity with low contact resistance
  • Excellent corrosion resistance from gold plating
  • Consistent signal transmission in extreme environments
  • Spooled format for precise handling in clean rooms
  • Ideal for research setups and laboratory applications
Product Images
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 0 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 1 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 2 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 3 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 4 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 5

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